US Patent Issued to SAMSUNG ELECTRONICS on June 16 for "Semiconductor package and method of fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,702, issued on June 16, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package and method of fabricating the same" was invented by Seongyo Kim (Suwon-si, South Korea), Un-Byoung Kang (Suwon-si, South Korea), Sang-Sick Park (Suwon-si, South Korea), Hanmin Lee (Suwon-si, South Korea) and Seungyoon Jung (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are semiconductor packages and their fabrication methods. The semiconductor package comprises a first semiconductor chip, a lower adhesion layer on the first semiconductor chip, a second semiconductor chip on the lower adhesion layer, an...