US Patent Issued to SAMSUNG ELECTRONICS on June 16 for "Semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,706, issued on June 16, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor package" was invented by Joo-Young Oh (Suwon-si, South Korea) and Hwan Pil Park (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a substrate, a first chip stack on the substrate and including a first semiconductor chip, an underfill pattern on a first side of the first chip stack, and a second chip stack on the first chip stack and including a second semiconductor chip. The second chip stack is stacked so as to be offset to the first chip stack. The first chip stack includes a first adhesi...