US Patent Issued to SAMSUNG ELECTRONICS on June 16 for "Semiconductor devices including bonded semiconductor layers and manufacturing methods of the same" (South Korean Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,713, issued on June 16, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor devices including bonded semiconductor layers and manufacturing methods of the same" was invented by Byeongchan Kim (Suwon-si, South Korea), Un-Byoung Kang (Suwon-si, South Korea), Jumyong Park (Suwon-si, South Korea), Dongjoon Oh (Suwon-si, South Korea), Jun Young Oh (Suwon-si, South Korea), Jeongil Lee (Suwon-si, South Korea) and Chungsun Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes: a semiconductor layer including a wire and an electrical element; and a plurality of metal pads on...