US Patent Issued to SAMSUNG ELECTRONICS on June 16 for "Method, apparatus, and system with integrated circuit manufacturing" (South Korean Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,708, issued on June 16, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Method, apparatus, and system with integrated circuit manufacturing" was invented by Yeunhee Huh (Suwon-si, South Korea) and Chisung Bae (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit (IC) system including a first substrate comprising passive components, a first power managing IC chip including a first power managing IC stacked on the first substrate, first IC chip group including a IC stacked on top of the first power managing IC chip, a control IC chip, stacked on top of the first IC group, including a control...