US Patent Issued to SAMSUNG ELECTRONICS on June 16 for "Chip stack structure and semiconductor package including the same" (South Korean Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,711, issued on June 16, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Chip stack structure and semiconductor package including the same" was invented by Junhyoung Kim (Suwon-si, South Korea), Jiwon Kim (Suwon-si, South Korea), Minyong Lee (Suwon-si, South Korea), Dohyung Kim (Suwon-si, South Korea) and Sukkang Sung (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The inventive concept provides a chip stack structure including a first semiconductor chip and a second semiconductor chip bonded to each other, and a semiconductor package including a plurality of chip stack structures stacked in a vertical ...