US Patent Issued to SAMSUNG ELECTRONICS on July 7 for "Substrate structure connected on basis of solder ball and elastic body" (South Korean Inventors)

ALEXANDRIA, Va., July 7 -- United States Patent no. 12,677,371, issued on July 7, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Substrate structure connected on basis of solder ball and elastic body" was invented by Jongwan Shim (Suwon-si, South Korea), Bumhee Bae (Suwon-si, South Korea), Younho Kim (Suwon-si, South Korea) and Jeongnam Cheon (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate structure is provided. The substrate structure includes a first substrate, a plurality of first elastomer pins arranged on the first substrate, an elastic body disposed on the first substrate to surround the plurality of first elastomer pins, the elastic body includ...