US Patent Issued to SAMSUNG ELECTRONICS on July 7 for "Semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., July 7 -- United States Patent no. 12,677,713, issued on July 7, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package" was invented by Jaegwon Jang (Hwaseong-si, South Korea), Kyoung Lim Suk (Suwon-si, South Korea) and Minjun Bae (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a redistribution substrate and a semiconductor chip on a top surface of the redistribution substrate. The redistribution substrate includes an insulating layer, and first, second, and third redistribution patterns disposed in the insulating layer. The first to third redistribution patterns are sequentially stacked in an up...