US Patent Issued to SAMSUNG ELECTRONICS on July 28 for "Tunneled direct link setup latency management for non-collocated APs" (American, Taiwanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,331, issued on July 28, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Tunneled direct link setup latency management for non-collocated APs" was invented by Yue Qi (Plano, Texas), Boon Loong Ng (Plano, Texas), Rubayet Shafin (Allen, Texas), Peshal Nayak (Plano, Texas), Vishnu Vardhan Ratnam (Plano, Texas) and Elliot Jen (Taipei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods and apparatuses for handling TDLS latency issues in non-collocated APs. A method of wireless communication performed by a first STA comprises: initiating a TDLS procedure between the first STA and a second STA via an AP of a plurality ...