US Patent Issued to SAMSUNG ELECTRONICS on July 28 for "Semiconductor package and a method of manufacturing the same" (South Korean Inventor)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,815, issued on July 28, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor package and a method of manufacturing the same" was invented by Gunho Chang (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first semiconductor chip including a first surface and an opposite second surface, second semiconductor chips vertically stacked on the first semiconductor chip, each of the second semiconductor chips including a third surface and an opposite fourth surface, and a molding layer on the first surface of the first semiconductor chip and at least partially surrounding ...