US Patent Issued to SAMSUNG ELECTRONICS on July 28 for "Semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,775, issued on July 28, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package" was invented by Seongho Shin (Suwon-si, South Korea) and Jonghyeon Kim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a semiconductor package comprising a solder ball, a printed circuit board on the solder ball, a bump on the printed circuit board, and a semiconductor chip on the bump. The printed circuit board includes a base substrate, a low-k dielectric layer that penetrates the base substrate, a connection conductive structure electrically connected to the bump and surrounded by the low-k diele...