US Patent Issued to SAMSUNG ELECTRONICS on July 28 for "Semiconductor device including metal lines having multi-layer structure" (New York, Virginia Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,742, issued on July 28, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor device including metal lines having multi-layer structure" was invented by Johnsoo Kim (Clifton Park, N.Y.), Joongsuk Oh (Watervliet, N.Y.) and Kang-Ill Seo (Springfield, Va.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a semiconductor device which includes: a base layer; and at least one metal line on the base layer, wherein each of the at least one metal line comprise a 1st metal structure and a 2nd metal structure on the 1st metal structure, the 1st metal structure is formed through a direct etching process, and the 2nd metal...