US Patent Issued to SAMSUNG ELECTRONICS on July 28 for "Semiconductor device including an insulating structure on a sidewall of a landing pad" (South Korean Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,439, issued on July 28, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor device including an insulating structure on a sidewall of a landing pad" was invented by Hongjun Lee (Suwon-si, South Korea), Kyungsun Ryu (Hwaseong-si, South Korea), Dongjun Lee (Anyang-si, South Korea) and Jin-Seong Lee (Gapyeong-gun, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes bit lines extending in a first direction on a substrate, a lower contact connected to the substrate between two adjacent ones of the bit lines, a landing pad on the lower contact, and an insulating structure surrounding ...