US Patent Issued to SAMSUNG ELECTRONICS on July 28 for "Semiconductor device and method for manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,474, issued on July 28, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Semiconductor device and method for manufacturing the same" was invented by Jin Bum Kim (Suwon-si, South Korea), Hyo Jin Kim (Suwon-si, South Korea), Yong Jun Nam (Suwon-si, South Korea), Sang Moon Lee (Suwon-si, South Korea), Dong Woo Kim (Suwon-si, South Korea) and In Geon Hwang (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a lower pattern extending in a first direction, and protruding from a substrate in a second direction, a lower insulating pattern on the lower pattern, and in contact with an ...