US Patent Issued to SAMSUNG ELECTRONICS on July 21 for "Semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,468, issued on July 21, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Semiconductor package" was invented by Jae Hyun Lim (Suwon-si, South Korea), Sung Woo Park (Suwon-si, South Korea), Hyun Jong Moon (Suwon-si, South Korea) and Kwang Jin Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package including a die paddle, a first lead spaced apart from the die paddle and on one side of the die paddle, a second lead spaced apart from the die paddle and on another side of the die paddle, a spacer on the die paddle, a semiconductor die on the spacer, a first wire configured to connect an ...