US Patent Issued to SAMSUNG ELECTRONICS on July 21 for "Semiconductor package" (South Korean Inventor)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,494, issued on July 21, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package" was invented by Jihoon Kim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first semiconductor structure including a first semiconductor substrate and a lower through structure that penetrates the first semiconductor substrate, a connection structure on the first semiconductor structure and a second semiconductor structure on the connection structure, the second semiconductor structure including a second semiconductor substrate and an upper through structure that penetrates the...