US Patent Issued to SAMSUNG ELECTRONICS on July 21 for "Method for supporting sidelink-relay in split RAN structure" (South Korean Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,087, issued on July 21, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Method for supporting sidelink-relay in split RAN structure" was invented by Beomsik Bae (Suwon-si, South Korea), Hyunjeong Kang (Suwon-si, South Korea) and Jinwoo Ock (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to a communication technique that merges IoT technology with a 5G communication system for supporting higher data transmission rates than 4G systems, and a system for same. The present disclosure may be applied to intelligent services (for example, smart homes, smart buildings, smart cities, ...