US Patent Issued to SAMSUNG ELECTRONICS on July 14 for "Semiconductor packages having a coupling member including a vertical wire and a metal portion extending around the vertical wire" (South Korean Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,190, issued on July 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor packages having a coupling member including a vertical wire and a metal portion extending around the vertical wire" was invented by Jaemok Jung (Suwon-si, South Korea), Un-Byoung Kang (Suwon-si, South Korea), Dowan Kim (Suwon-si, South Korea), Sung Keun Park (Suwon-si, South Korea), Jongho Park (Suwon-si, South Korea) and Ju-Il Choi (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An embodiment provides a semiconductor package including: a first redistribution layer substrate; a semiconductor chip on the first redistribut...