US Patent Issued to SAMSUNG ELECTRONICS on July 14 for "Semiconductor packages" (South Korean Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,226, issued on July 14, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor packages" was invented by Hyoeun Lee (Suwon-si, South Korea), Hyunggil Baek (Suwon-si, South Korea), Su-Chang Lee (Suwon-si, South Korea) and Gyunghwan Oh (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a substrate including a first region having a recess defined therein and a second region spaced apart from the first region. The second region does not include the recess. A three-dimensional (3D) integrated circuit structure is on the first region. The 3D integrated circuit structure incl...