US Patent Issued to SAMSUNG ELECTRONICS on July 14 for "Semiconductor package and semiconductor device including the same" (South Korean Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,160, issued on July 14, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package and semiconductor device including the same" was invented by Youngdeuk Kim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes: a first semiconductor chip; a plurality of second semiconductor chips sequentially stacked on the first semiconductor chip, the plurality of second semiconductor chips including an uppermost semiconductor chip including a central region and a peripheral region at a periphery of the central region; at least one first temperature sensor provided on an upper sur...