US Patent Issued to SAMSUNG ELECTRONICS on July 14 for "Semiconductor package and method for manufacturing the semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,213, issued on July 14, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package and method for manufacturing the semiconductor package" was invented by Seokgeun Ahn (Suwon-si, South Korea), Seokhyun Lee (Suwon-si, South Korea) and Hwanyoung Choi (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes: a substrate; a circuit layer disposed on a lower surface of the substrate, the circuit layer including an interconnection structure; a first redistribution structure disposed adjacent to the circuit layer, the first redistribution structure including a first redistribut...