US Patent Issued to SAMSUNG ELECTRONICS on July 14 for "Semiconductor device and method of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,759, issued on July 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Semiconductor device and method of manufacturing the same" was invented by Hoin Lee (Suwon-si, South Korea), Byung-Hyun Lee (Suwon-si, South Korea) and Hoouk Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a substrate including a cell array region and a core region disposed around the cell array region; a plurality of storage element contacts; a contact plug; and a contact plug spacer. The plurality of storage element contacts may include a first storage element contact and at least one second st...