US Patent Issued to SAMSUNG ELECTRONICS on July 14 for "Semiconductor device and method of fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,123, issued on July 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Semiconductor device and method of fabricating the same" was invented by Kyoungwoo Lee (Suwon-si, South Korea), Yunsuk Nam (Suwon-si, South Korea), Jinkyu Kim (Suwon-si, South Korea), Sora You (Suwon-si, South Korea), Sungmoon Lee (Suwon-si, South Korea) and Seungmin Cha (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device may include first active patterns adjacent to each other on a substrate, first source/drain patterns respectively on the first active patterns and adjacent to each other, a first division struct...