US Patent Issued to SAMSUNG ELECTRONICS on Feb. 24 for "Semiconductor package including a redistribution substrate and a pair of signal patterns" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,564,079, issued on Feb. 24, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package including a redistribution substrate and a pair of signal patterns" was invented by Yun-Hee Lee (Hwaseong-si, South Korea), Jaesun Kim (Hwaseong-si, South Korea), Seokbeom Yong (Yongin-si, South Korea) and Wonjae Lee (Yongin-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a semiconductor package comprising a redistribution substrate and a semiconductor chip on the redistribution substrate. The redistribution substrate includes a plurality of first conductive patterns including a pair of first signal pattern...