ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,564,103, issued on Feb. 24, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).
"Semiconductor package" was invented by Seokgeun Ahn (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package, includes: a first semiconductor chip including first connection pads on the first front surface, and through electrodes extending perpendicularly to the first rear surface and electrically connected to at least a portion of the first connection pads; a second semiconductor chip including second connection pads on the second front surface, and on the first rear surface so that the second rear surface faces the fi...