US Patent Issued to SAMSUNG ELECTRONICS on Feb. 24 for "Semiconductor device having improved device bonding features, performance and reliability" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,563,743, issued on Feb. 24, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor device having improved device bonding features, performance and reliability" was invented by Yongjae Lee (Suwon-si, South Korea), Seung Pil Ko (Suwon-si, South Korea), Kilho Lee (Suwon-si, South Korea) and Jeongjin Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes cell lower conductive lines and peripheral lower conductive lines on a substrate, lower electrode contacts on the cell lower conductive lines, peripheral conductive contacts on the peripheral lower conductive lines, variable re...