US Patent Issued to SAMSUNG ELECTRONICS on Feb. 24 for "Resist compound, method for forming pattern using same, and method for manufacturing semiconductor device using same" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,560,865, issued on Feb. 24, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Resist compound, method for forming pattern using same, and method for manufacturing semiconductor device using same" was invented by Jin Kyun Lee (Incheon, South Korea) and Hyun Taek Oh (Incheon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are a resist compound, a method of forming a pattern by using the same, and a method of manufacturing a semiconductor device using the same. According to the present disclosure, the compound may be represented by Formula 1:"

The patent was filed on Aug. 18, 2022, under Application No. 17/890,...