US Patent Issued to SAMSUNG ELECTRONICS on Feb. 24 for "Memory module having first connection bumps and second connection bumps" (South Korean Inventor)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,564,080, issued on Feb. 24, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Memory module having first connection bumps and second connection bumps" was invented by Wonyoung Kim (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A memory module, includes a module substrate and at least one semiconductor package on the module substrate that includes a package substrate having a lower surface and an upper surface. First and second groups of lower pads are on the lower surface, and upper pads are on the upper surface and are electrically connected to the lower pads of the first group. A chip structure is on the upper ...