US Patent Issued to SAMSUNG ELECTRONICS on Feb. 17 for "Substrate transfer device, substrate transfer system and substrate transfer method" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,590, issued on Feb. 17, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Substrate transfer device, substrate transfer system and substrate transfer method" was invented by Jun Kyu Lee (Suwon-si, South Korea), Hongjin Kim (Suwon-si, South Korea) and Jeongjae Bang (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate transfer device includes a housing accommodating a carrier for storing a substrate, a carrier lifter moving the carrier in a vertical direction relative to an upper surface of the housing, a vertical stabilization unit connected to a lower part of the carrier lifter and reducing a vertica...