US Patent Issued to SAMSUNG ELECTRONICS on Feb. 17 for "Printed circuit board having cutting position identification mark and alignment mark and semiconductor package having the same" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,209, issued on Feb. 17, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Printed circuit board having cutting position identification mark and alignment mark and semiconductor package having the same" was invented by Kanggyune Lee (Suwon-si, South Korea), Hyunggil Baek (Suwon-si, South Korea), Youngja Kim (Cheonan-si, South Korea) and Seungjin Lee (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A printed circuit board includes a substrate base; a plurality of ball lands arranged on a surface of the substrate base; a cutting position identification mark disposed on a corner of the surface of the substrat...