US Patent Issued to SAMSUNG ELECTRONICS on Feb. 17 for "Polishing pad and substrate processing apparatus including the same" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,551,982, issued on Feb. 17, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Polishing pad and substrate processing apparatus including the same" was invented by Donghoon Kwon (Suwon-si, South Korea), Boun Yoon (Suwon-si, South Korea) and Kihoon Jang (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing apparatus includes a polishing platen including a fluid channel, a polishing pad provided on a first surface of the polishing platen, the polishing pad including a pad body including a trench and a thermal conductive body provided in the trench of the pad body and connected to the first surface...