US Patent Issued to SAMSUNG ELECTRONICS on Feb. 17 for "Integrated circuit device and method of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,267, issued on Feb. 17, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Integrated circuit device and method of manufacturing the same" was invented by Kyooho Jung (Seoul, South Korea), Jongyeong Min (Suwon-si, South Korea), Jiye Baek (Suwon-si, South Korea), Yeseul Lee (Suwon-si, South Korea), Jinwook Lee (Seoul, South Korea) and Wonsik Choi (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit device may include a plurality of lower electrodes above a substrate, a supporter between the plurality of lower electrodes, an upper electrode on the plurality of lower electrodes, and a capaci...