ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,680, issued on Feb. 17, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).
"Integrated circuit device" was invented by Seungmin Cha (Suwon-si, South Korea), Seungmin Song (Suwon-si, South Korea), Youngwoo Kim (Suwon-si, South Korea), Jinkyu Kim (Suwon-si, South Korea), Sora You (Suwon-si, South Korea), Namhyun Lee (Suwon-si, South Korea) and Sungmoon Lee (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit device includes a substrate, having a front surface and a rear surface opposite to each other, and a fin-type active region defined by a trench in the front surface, a device separation lay...