ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,412, issued on Feb. 17, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Image sensor package" was invented by Youngmin Yun (Sejong-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "An image sensor package includes an image sensor chip including an active pixel sensor region including a plurality of unit pixels, a perimeter region, and a pad region and including a plurality of chip pads. The image sensor package also includes a printed circuit board under the image sensor chip and including a plurality of bonding pads, bonding wires connecting the plurality of chip pads to the plurality of bonding pads, respectivel...