ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,413, issued on Feb. 17, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Image sensor package" was invented by Sang-Uk Kim (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "An image sensor package according to an embodiment includes: an image sensor chip having a sensing area of a central part and an outer area surrounding the sensing area; a transparent substrate spaced apart from and above the image sensor chip and covering the image sensor chip; a bonding structure disposed between the image sensor chip and the transparent substrate and provided on an upper surface of the outer area; and a package substra...