US Patent Issued to SAMSUNG ELECTRONICS on Dec. 30 for "Wafer structure and semiconductor device" (South Korean Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,513,973, issued on Dec. 30, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Wafer structure and semiconductor device" was invented by Junyun Kweon (Cheonan-si, South Korea), Yeongbeom Ko (Cheonan-si, South Korea), Wooju Kim (Anyang-si, South Korea), Heejae Nam (Anyang-si, South Korea), Jungseok Ryu (Anyang-si, South Korea) and Junho Yoon (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are wafer structures and semiconductor devices. A semiconductor device may include a substrate and a cell array structure on the substrate. The substrate may include a device region and a dummy region surrounding the d...