US Patent Issued to SAMSUNG ELECTRONICS on Aug. 4 for "Solder reflow apparatus and method of manufacturing an electronic device" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,697,671, issued on Aug. 4, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Solder reflow apparatus and method of manufacturing an electronic device" was invented by Junga Lee (Suwon-si, South Korea), Youngja Kim (Suwon-si, South Korea), Hyunki Kim (Suwon-si, South Korea) and Youngmin Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus includes: a vapor generating chamber configured to accommodate a heat transfer fluid and to be filled with saturated vapor generated by the heat transfer fluid; a heater configured to heat the heat transfer fluid in the vapor generating chamber; a substrate stage con...