US Patent Issued to SAMSUNG ELECTRONICS on Aug. 4 for "Semiconductor package and method of manufacturing the semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,034, issued on Aug. 4, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor package and method of manufacturing the semiconductor package" was invented by Jaeean Lee (Suwon-si, South Korea), Dahee Kim (Suwon-si, South Korea), Taehoon Lee (Suwon-si, South Korea) and Gyujin Choi (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An upper redistribution wiring layer of a semiconductor package includes a protective layer provided on at least one upper insulating layer and having an opening that exposes at least a portion of an uppermost redistribution wiring among second redistribution wirings, and a bon...