US Patent Issued to SAMSUNG ELECTRONICS on Aug. 4 for "Semiconductor package and display apparatus including the same" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,032, issued on Aug. 4, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package and display apparatus including the same" was invented by Narae Shin (Suwon-si, South Korea), Seongho Shin (Suwon-si, South Korea) and Seonghwan Jeon (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a base film, a first conductive structure disposed on a first surface of the base film, a second conductive structure disposed on a second surface of the base film, a via passing through the base film and connecting the first conductive structure to the second conductive structure, a semi...