US Patent Issued to SAMSUNG ELECTRONICS on Aug. 4 for "Semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,019, issued on Aug. 4, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor package" was invented by Kanggyune Lee (Suwon-si, South Korea), Sangwon Lee (Suwon-si, South Korea) and Woojin Choi (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a package substrate, a first semiconductor chip on the package substrate, a sealing layer on the package substrate and at least partially covering the first semiconductor chip and including an upper surface, a first side surface, and a first inclined surface extending between the upper surface and the first side surface, and a fi...