US Patent Issued to SAMSUNG ELECTRONICS on Aug. 4 for "Semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,721, issued on Aug. 4, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor package" was invented by Sang-Sick Park (Suwon-si, South Korea), Un-Byoung Kang (Suwon-si, South Korea), Min Soo Kim (Suwon-si, South Korea) and Seon Gyo Kim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first structure, a first semiconductor chip on the first structure, a first conductive pad on the first structure between the first structure and the first semiconductor chip, a second conductive pad on a lower surface of the first semiconductor chip and vertically overlapping the first...