US Patent Issued to SAMSUNG ELECTRONICS on Aug. 4 for "Semiconductor package" (South Korean Inventor)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,067, issued on Aug. 4, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package" was invented by Gunho Chang (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first semiconductor chip, a chip stack on the first semiconductor chip, and a mold layer enclosing the chip stack, on the first semiconductor chip. The chip stack includes second semiconductor chips vertically stacked on the first semiconductor chip, a third semiconductor chip on the second semiconductor chips, and non-conductive layers filling spaces between adjacent ones of the second semiconductor chip...