US Patent Issued to SAMSUNG ELECTRONICS on Aug. 4 for "Semiconductor devices including conductive structures" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,987, issued on Aug. 4, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor devices including conductive structures" was invented by Doohyun Lee (Suwon-si, South Korea), Heonjong Shin (Suwon-si, South Korea) and Seon-Bae Kim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor devices and fabrication methods thereof. For example, a semiconductor device may include a dielectric structure, and first conductive structures and second conductive structures. The dielectric structure may include a first dielectric layer that surrounds the first conductive structures and a second dielectric layer...