US Patent Issued to SAMSUNG ELECTRONICS on Aug. 4 for "Semiconductor device including extended backside contact structure" (New York, Virginia Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,768, issued on Aug. 4, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor device including extended backside contact structure" was invented by Seung Min Song (Halfmoon, N.Y.), Panjae Park (Clifton Park, N.Y.) and Kang-ill Seo (Springfield, Va.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a semiconductor device which includes: a backside contact plug, formed at a back side of the semiconductor device, below a source/drain region connected to the backside contact plug, wherein the backside contact plug includes a 1st portion which is not vertically overlapped by the circuit element."

The patent was file...