ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,018, issued on Aug. 4, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).
"Method of marking semiconductor package" was invented by Kanggyune Lee (Suwon-si, South Korea), Sangwon Lee (Suwon-si, South Korea) and Hyeon Hwang (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method of marking a semiconductor package includes preparing a semiconductor package including a semiconductor chip and a package molding layer surrounding semiconductor chip, attaching a dry film to a top surface of the package molding layer, the dry film being attached to a carrier substrate, forming an ink spot by liquefying a portion of t...