ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,659, issued on Aug. 4, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Circuit board module and method for manufacturing same" was invented by Yonglak Cho (Suwon-si, South Korea), Joohan Kim (Suwon-si, South Korea), Juho Kim (Suwon-si, South Korea), Min Park (Suwon-si, South Korea), Eunsoo Park (Suwon-si, South Korea), Insun An (Suwon-si, South Korea), Byungwoo Lee (Suwon-si, South Korea), Sangtae Lee (Suwon-si, South Korea) and Haejin Lee (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit board module includes a first substrate, a second substrate provided above the first substrate and including a ...