US Patent Issued to SAMSUNG ELECTRONICS on Aug. 25 for "Test device and semiconductor manufacturing apparatus including test device" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,716,938, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea).

"Test device and semiconductor manufacturing apparatus including test device" was invented by Jihyun Choi (Suwon-si, South Korea), Seonmi Lee (Suwon-si, South Korea), Yonggyun Kim (Suwon-si, South Korea), Seongseob Shin (Suwon-si, South Korea), Dahm Yu (Suwon-si, South Korea) and Dongho Lee (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A test device includes a test board, a connector attached to a lower surface of the test board, a heating device disposed on an upper surface of the test board, the heating device configured to emit...