US Patent Issued to SAMSUNG ELECTRONICS on Aug. 25 for "Systems, methods, and apparatus for processing in memory using die-to-die interconnects" (California Inventor)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,717,749, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. LTD. (South Korea).

"Systems, methods, and apparatus for processing in memory using die-to-die interconnects" was invented by Hyoun Kwon Jeong (Pleasanton, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus may include a first device including at least one first die including a first interface, a memory media configured to store first information received using the first interface, and a compute element configured to perform, using the first information, a compute operation, and a second device including at least one second die including a second interface configured to ...