ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,233, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).
"Stacked semiconductor package" was invented by Dawoon Jung (Suwon-si, South Korea), Seungduk Baek (Suwon-si, South Korea) and Donghun Lee (Suwon-si, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a base structure and a plurality of semiconductor chips disposed on the base structure. Each of the plurality of semiconductor chips has a chip region. The plurality of semiconductor chips are stacked in a vertical direction such that chip regions at least partially overlap each other. In the stack of the plurality of s...