US Patent Issued to SAMSUNG ELECTRONICS on Aug. 25 for "Solder reflow apparatus and method of manufacturing electronic device" (South Korean Inventor)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,205, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Solder reflow apparatus and method of manufacturing electronic device" was invented by Youngja Kim (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "In a method of manufacturing an electronic device, a substrate having a plurality of mounting regions on which first electronic components and second electronic components are mounted is provided, the substrate having a first surface and a second surface opposite the first surface. First electronic components are mounted on the first surface of the board via first bumps. At least one vapor ...