US Patent Issued to SAMSUNG ELECTRONICS on Aug. 25 for "Semiconductor package and system including semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,224, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea).

"Semiconductor package and system including semiconductor package" was invented by Hyojin Yun (Suwon-si, South Korea), Unbyoung Kang (Suwon-si, South Korea), Seokbong Park (Suwon-si, South Korea), Sechul Park (Suwon-si, South Korea), Junyoung Park (Suwon-si, South Korea), Teahwa Jeong (Suwon-si, South Korea) and Juil Choi (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a substrate including a first region, a second region in contact with the first region with the first and second regions stacked in a fi...